features x plastic package has underwriters laboratories flammability classification 94v-0 x glass passivated chip junction x for surface mount application x low profile package x built-in strain relief, ideal for automated placement mechanical data x case: jedec sod-123fl, molded plastic over passivated chip x terminals: solder plated, solderable per x high temperature solder: 250 : /10 seconds at terminals x polarity: color band denotes cathode end absolute maximum ratings and characteristics ratings at 25 o c ambient temperature unless otherwise specified. symbols maximum recurrent peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current i f(av) 1.0 a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) t l = 110 o c i fsm 40 30 a maximum instantaneous forward voltage at 1.0a v f 1.1 v 1.0 5.0 maximum dc reverse current at rated dc blocking voltage at t a = 25 : at t a = 125 : i r i r 50 ? a typical junction capacitance at v r = 4.0 v, f = 1 mh z c tot 12 pf typical reverse recovery time at i f = 0.5a, i r = 1.0a, irr = 0.25a t rr 1.8 ? s 75 85 typical thermal resistance (note 1) r t ja r t jl 27 30 o c/w operating junction and storage temperature range t j ,t s -55 to +150 o c notes: 1. thermal resistance from junction to ambient from junction to lead mounted on p.c.b. with 0.2 j 0.2 (5.0 j 5.0mm 2 ) copper pad areas sod-123fl/sub-sma unit: inch (mm) sm4001pl units 0.032(0.80) 0.019(0.50) 0.145(3.70) 0.008(0.20) 0.004(0.10) 0.137(3.50) 0.117(2.95) 0.077(1.95) 0.043(1.08) 0.042(1.05) 0.104(2.65) 0.064(1.65) 0.038(0.98) 0.029(0.75) ? sm4001pl thru sm4007pl pb free plating product pb sm4001pl thru sm4007pl 1.0 ampere surface mount general purpose rectifier ? 2006 thinki semiconductor co.,ltd. http://www.thinkisemi.com/ page 1/2 sm4002pl sm4003pl SM4004PL sm4005pl sm4006pl sm4007pl x free datasheet http:///
fig.1-forward derating curve lead temperature, ( c) 0.2x0.2(5.0x5.0mm) thick copper pad areas resistive or inductive load a v e r a g e f o r w a r d c u r r e n t , a 0.2 20 0 040 60 0.8 0.4 0.6 1 1.2 120 100 80 140 160 p e a k f o r w a r d s u r g e c u r r e n t , a number of cycles at 60hz 1 1 10 100 fig.2- peak forward surge current 10 100 t l =110 c 8.3ms single half sine wave (jedec method) i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) instantaneous forward voltage (v) 0.6 0.8 0.4 0.01 0.1 1 t j =25 c pulse width=300 s 1% duty cycle 1.6 1.4 1.0 1.2 2.0 1.8 o fig.3-typical forward characteristics 10 100 t j =125 c i n s t a n t a n e o u s r e v e r s e c u r r e n t ( a ) 0.001 0.1 0.01 percent of rated peak reverse volts,% 1 c 60 20 40 0100 80 t j =25 t j =75 c 10 100 fig.4-typical reverse characteristics 100 10 j u n c t i o n c a p a c i t a n c e , p f reverse voltage, v 0.01 1 0.1 1 10 100 fig.5- typical junction capacitance t j =25 c f=1.0mhz vsig=50mvp-p t r a n s i e n t t h e r m a l i m p e d a n c e ( c / w ) t, pulse duration 0.01 1 10 0.1 1 10 100 100 o 1000 fig.6- transient thermal impedance ? sm4001pl thru sm4007pl ? 2006 thinki semiconductor co.,ltd. http://www.thinkisemi.com/ page 2/2 free datasheet http:///
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